p p js66 3 1 j uly 1 , 201 5 - r ev. 00 page 1 2 0 v p - mosfet load switch with level shift & adjustable slew rate voltage 2 0 v current 2.0 a sot - 23 6l unit : inch(mm) f eatures ? vdrop = 0.2v@vin=12v , il= 2.0 a, r ds(on) = 100 m ? ? vdrop = 0.2v@vin= 5.0 v, il= 1.8 a, r ds(on) = 110 m ? ? vdrop = 0.2v@vin= 2 .5 v, il= 1.4 a, r ds(on) = 140 m ? ? advanced trench process technology ? adjustable turn on/off slew rate control through e xternal r1, r2 and c1 . ? lead free in compliance with eu rohs 2011/65/eu direc tive. ? green molding compound as per iec61249 std. (halogen free) mechanical data ? case: sot - 23 6l package ? terminals: solderable per mil - std - 750, method 2026 ? approx. weight: 0.0005 ounces, 0.014 grams ? marking: s l 1 parameter symbol ratings units input voltage range (note 1 ) v in 2 0 v on/off voltage range v on / v off 12 v continuous load current t (note 2 ,3 ) i d 2 a pulsed load current (note 4 ) i d 8 a power dissipation (note 2 ) p d 0.83 w operatin g junction an d storage temperature range t j ,t stg - 55~15 0 o c esd, mil - std - 883d hbm (100pf/1.5kohm) ( von/off pin ) v es d 2 kv t ypical j unction to ambient (note 2 ) r ja o c /w maximum ratings and thermal characteristics (t a =25 o c unless otherwise noted)
p p js66 3 1 j uly 1 , 201 5 - r ev. 00 page 2 e lectrical c haracteristics (t a =25 o c unless otherwise noted) parameter symbol test condition min. typ. max. units off characteristics leakage current i fl v in = 20 v, v on / v off =0v - - 1 ua diode forward voltage v sd i s = - 1.0 a - - 0.76 - 1.2 v on characteristics input voltage range v in 2.5 - 20 v on/off vo ltage range v on / v off 2.5 - 12 v drain - source on - state resistance (q2) r ds(on) v gs = - 12 v, i d = - 2.0 a - 84 100 m gs = - 5.0 v, i d = - 1.8 a - 90 110 v gs = - 2.5 v, i d = - 1.4 a - 110 140 notes : 1. v in range can be up to 20v, but r1 and r2 must be scaled such that v gs do not exceed 12v. 2. r ? ja is the sum of the junction - to - case and case - to - ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins m ounted on a 1 inch fr - 4 with 2oz . square pad of copper 3. the maximum current rating is package limited 4. pulse test: pulse width < 300us, duty cycle < 2% application circu its component table r1 pull - up resistor typical 1 0 k note: r1 should be at least 10 * r2 to ensure q1 turn - on
p p js66 3 1 j uly 1 , 201 5 - r ev. 00 page 3 t ypical characteristic curves fig.1 output characteristics fig. 2 vdrop vs lo ad current at vin= 12v fig. 3 vdrop vs load current at vin= 4. 5v fig. 4 vdrop vs load current at vin= 2.5v fig. 5 on - resistance variation with vgs. fig. 6 normalize rds(on) vs junction temperature
p p js66 3 1 j uly 1 , 201 5 - r ev. 00 page 4 t ypical characteristic curves fig. 7 switching variation r2 at vin=12v, r1=20 k fig. 8 switching variation r2 at vin= 5v, r1= 20k fig. 9 s witching variation r2 at vin=3.3 v, r1=20 k fig. 10 s witching variation r2 at vin=2.5 v, r1= 20 k fig. 11 switching variation r2 at vin=1 2v, r1=300k fig. 12 switching variation r2 at vin= 5v, r1=3 0 0 k
p p js66 3 1 j uly 1 , 201 5 - r ev. 00 page 5 t ypical characteristic curves fig. 13 switching variation r2 at vin=12v, r1=20 k fig. 14 transient thermal response curve
p p js66 3 1 j uly 1 , 201 5 - r ev. 00 page 6 part no packing code version mounting pad layout part no pa cking code package type packing type marking ver sion pjs 66 3 1 _ s 1_00001 sot - 23 6l 3k pcs / 7 0.024 (0.60) 0 . 0 2 6 ( 0 . 6 7 ) 0 . 0 9 6 ( 2 . 4 3 ) 0.037 (0.95) 0.037 (0.95)
p p js66 3 1 j uly 1 , 201 5 - r ev. 00 page 7 disclaimer
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